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packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-89444012a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962-8944401ea active cdip j 16 1 tbd a42 snpb n / a for pkg type 5962-8944401ea active cdip j 16 1 tbd a42 snpb n / a for pkg type 5962-8944401fa active cfp w 16 1 tbd a42 n / a for pkg type 5962-8944401fa active cfp w 16 1 tbd a42 n / a for pkg type 5962-89756012a obsolete lccc fk 20 tbd call ti call ti 5962-89756012a obsolete lccc fk 20 tbd call ti call ti 5962-8975601sa obsolete cfp w 20 tbd call ti call ti 5962-8975601sa obsolete cfp w 20 tbd call ti call ti sn54ls597j active cdip j 16 1 tbd a42 snpb n / a for pkg type sn54ls597j active cdip j 16 1 tbd a42 snpb n / a for pkg type sn54ls598j obsolete cdip j 20 tbd call ti call ti sn54ls598j obsolete cdip j 20 tbd call ti call ti sn74ls597d active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597d active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597de4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597de4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597drg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597drg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597n active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn74ls597n active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn74ls597ne4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn74ls597ne4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn74ls597nsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim package option addendum www.ti.com 4-jun-2007 addendum-page 1
orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) sn74ls597nsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597nsre4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597nsre4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597nsrg4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597nsrg4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598n active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74ls598n active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74ls598ne4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74ls598ne4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type SNJ54LS597FK active lccc fk 20 1 tbd post-plate n / a for pkg type SNJ54LS597FK active lccc fk 20 1 tbd post-plate n / a for pkg type snj54ls597j active cdip j 16 1 tbd a42 snpb n / a for pkg type snj54ls597j active cdip j 16 1 tbd a42 snpb n / a for pkg type snj54ls597w active cfp w 16 1 tbd a42 n / a for pkg type snj54ls597w active cfp w 16 1 tbd a42 n / a for pkg type snj54ls598fk obsolete lccc fk 20 tbd call ti call ti snj54ls598fk obsolete lccc fk 20 tbd call ti call ti snj54ls598j obsolete cdip j 20 tbd call ti call ti snj54ls598j obsolete cdip j 20 tbd call ti call ti snj54ls598w obsolete 20 tbd call ti call ti snj54ls598w obsolete 20 tbd call ti call ti (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. package option addendum www.ti.com 4-jun-2007 addendum-page 2
(2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 4-jun-2007 addendum-page 3
tape and reel information package materials information www.ti.com 9-jun-2007 pack materials-page 1
device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74ls597dr d 16 fmx 330 16 6.5 10.3 2.1 8 16 q1 sn74ls597nsr ns 16 mla 330 16 8.2 10.5 2.5 12 16 q1 tape and reel box information device package pins site length (mm) width (mm) height (mm) sn74ls597dr d 16 fmx 342.9 336.6 28.58 sn74ls597nsr ns 16 mla 342.9 336.6 28.58 package materials information www.ti.com 9-jun-2007 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-89444012a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962-8944401ea active cdip j 16 1 tbd a42 snpb n / a for pkg type 5962-8944401ea active cdip j 16 1 tbd a42 snpb n / a for pkg type 5962-8944401fa active cfp w 16 1 tbd a42 n / a for pkg type 5962-8944401fa active cfp w 16 1 tbd a42 n / a for pkg type 5962-89756012a obsolete lccc fk 20 tbd call ti call ti 5962-89756012a obsolete lccc fk 20 tbd call ti call ti 5962-8975601sa obsolete cfp w 20 tbd call ti call ti 5962-8975601sa obsolete cfp w 20 tbd call ti call ti sn54ls597j active cdip j 16 1 tbd a42 snpb n / a for pkg type sn54ls597j active cdip j 16 1 tbd a42 snpb n / a for pkg type sn54ls598j obsolete cdip j 20 tbd call ti call ti sn54ls598j obsolete cdip j 20 tbd call ti call ti sn74ls597d active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597d active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597de4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597de4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597dre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597drg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597drg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597n active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn74ls597n active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn74ls597ne4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn74ls597ne4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type sn74ls597nsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim package option addendum www.ti.com 9-oct-2007 addendum-page 1
orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) sn74ls597nsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597nsre4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597nsre4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597nsrg4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls597nsrg4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74ls598n active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74ls598n active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74ls598ne4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74ls598ne4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type SNJ54LS597FK active lccc fk 20 1 tbd post-plate n / a for pkg type SNJ54LS597FK active lccc fk 20 1 tbd post-plate n / a for pkg type snj54ls597j active cdip j 16 1 tbd a42 snpb n / a for pkg type snj54ls597j active cdip j 16 1 tbd a42 snpb n / a for pkg type snj54ls597w active cfp w 16 1 tbd a42 n / a for pkg type snj54ls597w active cfp w 16 1 tbd a42 n / a for pkg type snj54ls598fk obsolete lccc fk 20 tbd call ti call ti snj54ls598fk obsolete lccc fk 20 tbd call ti call ti snj54ls598j obsolete cdip j 20 tbd call ti call ti snj54ls598j obsolete cdip j 20 tbd call ti call ti snj54ls598w obsolete 20 tbd call ti call ti snj54ls598w obsolete 20 tbd call ti call ti (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. package option addendum www.ti.com 9-oct-2007 addendum-page 2
(2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 9-oct-2007 addendum-page 3
tape and reel box information device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74ls597dr d 16 site 27 330 16 6.5 10.3 2.1 8 16 q1 sn74ls597nsr ns 16 site 41 330 16 8.2 10.5 2.5 12 16 q1 package materials information www.ti.com 4-oct-2007 pack materials-page 1
device package pins site length (mm) width (mm) height (mm) sn74ls597dr d 16 site 27 342.9 336.6 28.58 sn74ls597nsr ns 16 site 41 346.0 346.0 33.0 package materials information www.ti.com 4-oct-2007 pack materials-page 2

mechanical data mlcc006b october 1996 post office box 655303 ? dallas, texas 75265 fk (s-cqcc-n**) leadless ceramic chip carrier 4040140 / d 10/96 28 terminal shown b 0.358 (9,09) max (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) a no. of min max 0.358 0.660 0.761 0.458 0.342 (8,69) min (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32) (18,78) ** 20 28 52 44 68 84 0.020 (0,51) terminals 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 12 13 14 15 16 18 17 11 10 8 9 7 5 4 3 2 0.020 (0,51) 0.010 (0,25) 6 1 28 26 27 19 21 b sq a sq 22 23 24 25 20 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. this package can be hermetically sealed with a metal lid. d. the terminals are gold plated. e. falls within jedec ms-004

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security rfid www.ti-rfid.com telephony www.ti.com/telephony low power www.ti.com/lpw video & imaging www.ti.com/video wireless wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2007, texas instruments incorporated

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